A brief summary of PCB terminology:

• Signal Integrity: Signal integrity is the ability of the PCB to maintain the integrity of the signals being transmitted between the components. This involves proper signal routing, trace impedance matching, and minimizing signal reflections.
• Power Integrity: Power integrity is the ability of the PCB to maintain the integrity of the power being supplied to the components. This involves proper power routing, minimizing voltage drop, and minimizing noise in the power supply.
• EMI/EMC: Electromagnetic interference (EMI) and electromagnetic compatibility (EMC) are important considerations in PCB design. While EMC refers to the PCB’s capacity to function without interference from other electromagnetic sources, EMI refers to the unwanted electromagnetic radiation that the PCB generates.
• Design for Manufacturing (DFM): Design for Manufacturing (DFM) is the process of designing the PCB in a way that is optimized for the manufacturing process. This involves considering factors such as component placement, trace routing, and panelization.
• Design for Test (DFT): Design for Test (DFT) is the process of designing the PCB in a way that makes it easier to test and diagnose issues. This involves considering factors such as test points, probe access, and fault coverage.
• High–Speed Design: High–speed design is the process of designing PCBs that can handle high–speed signals, such as those used in communication systems. This involves considerations such as signal integrity, power integrity, and EMI/EMC.
• PCB Assembly: PCB assembly is the process of assembling the components onto the PCB. This involves considerations such as soldering techniques, inspection, and testing.
• PCB Testing: PCB testing is the process of testing the PCB to ensure that it meets the required specifications. This involves considerations such as functional testing, environmental testing, and reliability testing.

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